GB/T 18663.4-2022

Active

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 4: Combination of performance levels for modular cabinets

电子设备机械结构　公制系列和英制系列的试验　第4部分：模数机柜的性能等级组合

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2022-10-14
Implementation
2023-05-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies the performance level combinations for modular cabinets used in electronic equipment, covering both metric and inch system configurations. It is applied in the design, testing, and procurement of enclosures for telecommunications, data centers, and industrial electronics to ensure structural integrity under vibration, shock, and static loads. The standard helps engineers and procurement professionals select cabinets that meet specific reliability and safety requirements based on combined performance criteria.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.