GB/T 18663.3-2020

Active

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 3: Electromagnetic shielding performance tests for cabinets and subracks

电子设备机械结构　公制系列和英制系列的试验　第3部分：机柜和插箱的电磁屏蔽性能试验

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2020-11-19
Implementation
2021-06-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies test methods for evaluating the electromagnetic shielding effectiveness of cabinets and subracks used in electronic equipment. It is applied in the design, manufacturing, and quality verification of enclosures for telecommunications, data centers, and industrial electronics to ensure compliance with electromagnetic compatibility (EMC) requirements. The tests cover both metric and inch system structures, providing a unified approach for shielding performance assessment across different product lines.

Related Standards

GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.