GB/T 17722-1999
ActiveGold-plated thickness measurement by SEM
金覆盖层厚度的扫描电镜测量方法
Application Summary AI generated
This standard specifies the method for measuring the thickness of gold coatings using a scanning electron microscope (SEM). It is applied in quality control and inspection within the electronics, jewelry, and decorative industries to verify the thickness of gold layers on components like connectors, circuit boards, and ornaments. The method is particularly relevant for thin coatings where precise, non-destructive measurement is required.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.