GB/T 15879.612-2025
UpcomingMechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化 第6-12部分：表面安装半导体器件封装外形图绘制的一般规则 密节距焊盘阵列封装（FLGA）的设计指南
Application Summary AI generated
This standard provides design guidelines for creating outline drawings of fine-pitch land grid array (FLGA) semiconductor device packages. It is applied in the electronics industry to ensure consistent mechanical specifications for surface-mounted components used in compact, high-density circuit board assemblies. The standard supports engineers and procurement professionals in defining package dimensions, tolerances, and land patterns for reliable manufacturing and assembly processes.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.