GB/T 15879.4-2019
ActiveMechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Application Summary AI generated
This standard defines a coding system and classification method for the physical outlines of semiconductor device packages, such as dual in-line packages (DIPs) and small outline integrated circuits (SOICs). It is applied in the electronics industry for design, procurement, and quality control, ensuring consistent identification and mechanical compatibility of packages across manufacturers and assembly processes.
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