GB/T 14620-2013
ActiveAlumina ceramic substrates for thin film integrated circuits
薄膜集成电路用氧化铝陶瓷基片
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging for alumina ceramic substrates used in thin film integrated circuits. It is applied in the electronics industry for manufacturing high-frequency, high-reliability thin film circuits, such as those in microwave devices, hybrid integrated circuits, and optoelectronic modules. The standard ensures substrate properties like surface roughness, flatness, and thermal stability meet the precise deposition and patterning needs of thin film processes.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.