GB/T 14619-2013
ActiveAlumina ceramic substrates for thick film integrated circuits
厚膜集成电路用氧化铝陶瓷基片
Application Summary AI generated
GB/T 14619-2013 specifies the technical requirements, test methods, inspection rules, and packaging for alumina ceramic substrates used in thick film integrated circuits. It applies to the production and quality control of substrates that serve as the base material for screen-printed conductive, resistive, and dielectric layers in hybrid microelectronics. This standard ensures dimensional stability, surface finish, and thermal properties critical for reliable circuit performance in industrial electronics and telecommunications equipment.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.