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石英晶体元件 电子元器件质量评定体系规范 第1部分:总规范
Quartz crystal units--A specification in the quality assessment system for electronic components--Part 1:Generic specification
石英晶体元件 电子元器件质量评定体系规范 第2部分:分规范 能力批准
Quartz crystal units--A specification in the quality assessment system for electronic components--Part 2:Sectional specification--Capability approval
硬面感光板中光致抗蚀剂和电子束抗蚀剂规范
Specification for photoresist/E-beam resist for hard surface photoplates
电容器用陶瓷介质材料
Ceramic dielectric materials used for capacitors
压敏电阻器用氧化锌陶瓷材料
Zinc oxide ceramics for use in varistors
半导体集成电路 电压比较器测试方法的基本原理
Semiconductor integrated circuits--General principles of measuring methods of voltage comparators
半导体集成电路 电压调整器测试方法的基本原理
Semiconductor integrated circuits--General principles of measuring methods of voltage regulator
半导体器件 集成电路 第1部分:总则
Semiconductor devices--Integrated circuits--Part 1:General
电子管词汇
Vocabulary of electronic tubes
膜集成电路和混合膜集成电路总规范
Generic specification for film integrated circuits and hybrid film integrated circuits
低频放大管壳额定的双极型晶体管空白详细规范
Blank detail specification for case-rated bipolar transistors for low-frequency amplification
电子设备用固定电阻器 第6部分:分规范 各电阻器可单独测量的固定电阻网络
Fixed resistors for use in electronic equipment--Part 6:Sectional specification--Fixed resistor networks with individually measurable resistors
开关用双极型晶体管空白详细规范
Blank detail specification for bipolar transistors for switching applications
膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)
Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
膜集成电路和混合膜集成电路分规范(采用能力批准程序)
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
陶瓷制品45°镜向光泽度试验方法
Standard test method for 45°specular gloss of ceramic ware
印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板
Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits
多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
有金属化孔单双面印制板分规范
Sectional specification:single and doublesided printed boards with plated-through holes
无金属化孔单双面印制板分规范
Sectional specification:single and doublesided printed boards with plain holes