GB/T 31469-2015
ActiveSemiconductor materials cutting fluid
半导体材料切削液
Application Summary AI generated
GB/T 31469-2015 specifies the technical requirements, test methods, inspection rules, and packaging for cutting fluids used in the processing of semiconductor materials such as silicon wafers. It is applied in the electronics manufacturing industry, specifically during the slicing, grinding, and dicing of semiconductor substrates to ensure cutting efficiency, surface quality, and compatibility with downstream cleaning processes.
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