GB/T 31469-2015

Active

Semiconductor materials cutting fluid

半导体材料切削液

Standard Type
GBT
ICS
31
CCS
L90
Status
Active
Issue Date
2015-05-15
Implementation
2016-01-01
Centralized Committee
国家标准委
Issuing Authority
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

GB/T 31469-2015 specifies the technical requirements, test methods, inspection rules, and packaging for cutting fluids used in the processing of semiconductor materials such as silicon wafers. It is applied in the electronics manufacturing industry, specifically during the slicing, grinding, and dicing of semiconductor substrates to ensure cutting efficiency, surface quality, and compatibility with downstream cleaning processes.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.