GB/T 14664-1993
AbolishedDimensional tolerances stipulation of plastic packaging mould
塑封模具尺寸公差规定
Application Summary AI generated
This standard specifies the dimensional tolerances for plastic packaging molds, ensuring precision in the manufacturing of molds used for encapsulating electronic components, such as integrated circuits and semiconductors. It is applied in the electronics industry, particularly during the design and production of transfer molding tools for plastic packaging processes. The standard provides a reference for quality control and interchangeability of mold components in high-volume manufacturing environments.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.