GB/T 14663-1993
AbolishedSpecification of plastic packaging mould
塑封模具技术条件
Application Summary AI generated
This standard specifies the technical conditions for plastic packaging molds, including requirements for materials, manufacturing precision, assembly, and surface treatment. It is applied in the production of molds used for encapsulating electronic components, such as integrated circuits and semiconductor devices, in the electronics manufacturing industry. The standard ensures consistent quality and interchangeability of molds used in injection or transfer molding processes for plastic packaging.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.