GB/T 8750-2014
AbolishedGold bonding wire for semiconductor package
半导体封装用键合金丝
Application Summary AI generated
GB/T 8750-2014 specifies the technical requirements, test methods, inspection rules, and packaging for gold bonding wire used in semiconductor packaging. It is applied in the electronics industry for connecting semiconductor chips to lead frames or substrates in integrated circuits and discrete devices. The standard ensures wire purity, mechanical properties, and bondability for reliable wire bonding processes in microelectronic assembly.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.