GB/T 8446.2-2022
ActiveHeat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
电力半导体器件用散热器 第2部分：热阻和流阻测量方法
Application Summary AI generated
This standard specifies the measurement methods for thermal resistance and fluid pressure drop (flow resistance) of heat sinks used with power semiconductor devices. It is applied in the testing and qualification of cooling systems for high-power electronic components, such as rectifiers, thyristors, and IGBT modules, ensuring thermal performance meets design specifications in industrial power electronics and traction applications.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.