GB/T 7092-2021

Active

Outline dimensions of semiconductor integrated circuits

半导体集成电路外形尺寸

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2021-03-09
Implementation
2021-10-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the outline dimensions, lead configurations, and tolerances for semiconductor integrated circuits. It is applied in the design, manufacturing, and quality inspection of IC packages to ensure mechanical interchangeability and compatibility with printed circuit boards and sockets. The standard is primarily used by electronics manufacturers and testing laboratories for product specification and procurement verification.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.