GB/T 7092-1993

Abolished

Outline dimensions of semiconductor integratedcircuits

半导体集成电路外形尺寸

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Abolished
Issue Date
1993-01-21
Implementation
1993-08-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家技术监督局

Application Summary AI generated

This standard specifies the outline dimensions and tolerances for semiconductor integrated circuits, including dual-in-line packages (DIPs), flat packs, and other common package types. It is applied in the design, manufacturing, and quality inspection of ICs to ensure mechanical interchangeability and compatibility with printed circuit boards and sockets. The standard is primarily used by Chinese electronics manufacturers and testing laboratories for product specification and procurement verification.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.