GB/T 6109.16-2008

Active

Enamelled round winding wire - Part 16: Solderable polyurethane enamelled round copper wire,class 155,with a bonding layer

漆包圆绕组线 第16部分:155级自粘性直焊聚氨酯漆包铜圆线

Standard Type
GBT
ICS
29.060.01
CCS
K12
Status
Active
Issue Date
2008-04-23
Implementation
2008-12-01
Centralized Committee
中国电器工业协会
Issuing Authority
中国电器工业协会

Application Summary AI generated

This standard specifies the requirements for solderable polyurethane enamelled round copper wire with a bonding layer, rated for thermal class 155. It is applied in the manufacturing of small motors, transformers, and electromagnetic coils where the wire must be self-bonding during winding and directly solderable without stripping the insulation. The standard ensures consistent performance in electrical devices requiring automated winding and soldering processes.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.