GB/T 5230-1995

Abolished

Electrodeposited copper foil

电解铜箔

Standard Type
GBT
ICS
77.120.30
CCS
H62
Status
Abolished
Issue Date
1995-04-18
Implementation
1995-12-01
Centralized Committee
中国有色金属工业协会
Issuing Authority
国家技术监督局

Application Summary AI generated

GB/T 5230-1995 specifies the technical requirements, dimensions, and testing methods for electrodeposited copper foil used in printed circuit boards (PCBs) and electronic components. It is applied in the electronics industry for manufacturing copper-clad laminates, ensuring consistent thickness, tensile strength, and purity for reliable circuit performance. The standard also governs quality control in production and procurement of copper foil for high-frequency and multilayer PCB applications.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.