GB/T 4909.12-2009
ActiveTest methods for bare wires - Part 12: Solderability test of coating - Solder globule method
裸电线试验方法 第12部分：镀层可焊性试验-焊球法
Application Summary AI generated
This standard specifies the solder globule method for evaluating the solderability of coatings on bare wires. It is primarily applied in the electrical and electronics industries to test the wetting and adhesion properties of tin or other metallic coatings on conductors, such as copper wires used in cables and connectors. The test ensures reliable solder joint formation during manufacturing and assembly processes.
Related Standards
GB/T 19666-2005
Flame retardant and fire resistant wires and cables General
GB/T 6108.3-2003
Basic dimensions of winding wires--Part 3: Dimensions of conductors of insulated rectangular copper winding wires
GB/T 19216.21-2003
Tests for electric cables under fire conditions--Circuit integrity--Part 21: Procedures and requirements--Cables of rated voltage up to and including 0.6/1.0kV
GB/T 19216.11-2003
Tests for electric cables under fire conditions--Circuit integrity--Part 11: Apparatus--Fire alone at a flame temperature of at least 750℃
GB/T 6108.2-2003
Basic dimensions of winding wires--Part 2: Maximum overall diameters of enamelled round winding wires
GB/T 18889-2002
Electric cables-test methods for accessories for power cables with rated voltages from 6kV(Um=7.2kV)up to 35kV(Um=40.5kV)
GB/T 18487.3-2001
Electric vehicle conductive charging system--A.C./D.C.electric vehicle charging station
GB/T 18487.2-2001
Electric vehicle conductive charging system--Electric vehicles requirements for conductiveconnection to an A.C./D.C.supply
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.