GB/T 46280.3-2025
ActiveSpecification for chiplet inerconnection interface—Part 3: Data link layer technical requirements
芯粒互联接口规范 第3部分：数据链路层技术要求
Application Summary AI generated
This standard specifies the technical requirements for the data link layer of chiplet interconnection interfaces, including data framing, flow control, error detection, and retransmission mechanisms. It is applied in the design and integration of multi-die semiconductor packages, particularly for high-performance computing, AI accelerators, and advanced system-in-package (SiP) products. The standard ensures reliable data transfer between chiplets from different manufacturers, enabling interoperability in heterogeneous integration environments.
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