GB/T 46280.2-2025
ActiveSpecification for chiplet interconnection interface—Part 2: Protocol layer technical requirements
芯粒互联接口规范 第2部分：协议层技术要求
Application Summary AI generated
This standard specifies the protocol layer technical requirements for chiplet interconnection interfaces, defining data transmission protocols, flow control mechanisms, and error handling procedures. It is applied in the design and integration of multi-die semiconductor packages, particularly for high-performance computing, AI accelerators, and advanced System-in-Package (SiP) products. The standard ensures interoperability between chiplets from different manufacturers during system-level integration and testing.
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