GB/T 46280.1-2025
ActiveSpecification for chiplet interconnection interface—Part 1: General principles
芯粒互联接口规范 第1部分：总则
Application Summary AI generated
This standard defines the general principles for chiplet interconnection interfaces, covering electrical signaling, protocol layers, and physical topology requirements. It is applied in the semiconductor industry for designing multi-die systems, such as advanced processors, AI accelerators, and high-performance computing modules, where multiple chiplets are integrated into a single package. The standard ensures interoperability between chiplets from different manufacturers, facilitating heterogeneous integration and scalable system-on-chip (SoC) development.
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