GB/T 44937.3-2025
UpcomingIntegrated circuits—Measurement of electromagnetic emissions—Part 3: Measurement of radiated emissions—Surface scan method
集成电路 电磁发射测量 第3部分：辐射发射测量 表面扫描法
Application Summary AI generated
This standard specifies the surface scan method for measuring radiated electromagnetic emissions from integrated circuits (ICs). It is applied in the electronics industry for evaluating electromagnetic compatibility (EMC) during IC design, validation, and quality control, particularly for high-frequency or densely packaged devices where near-field scanning is needed to identify emission sources on the chip or package surface.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.