GB/T 44801-2024
ActiveTerminology of system in packgae（SiP）
系统级封装（SiP）术语
Application Summary AI generated
GB/T 44801-2024 defines standardized terminology for system-in-package (SiP) technology, covering key terms related to design, manufacturing, testing, and integration of multiple electronic components within a single package. It is applied in the semiconductor and electronics industry to ensure consistent communication among engineers, researchers, and procurement professionals working on SiP-based products such as mobile devices, IoT modules, and high-performance computing systems. The standard facilitates clear technical documentation and quality control across design, production, and supply chain processes.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.