GB/T 44795-2024
ActiveGeneral requirements for integral substrate of System in Package（SiP）
系统级封装（SiP）一体化基板通用要求
Application Summary AI generated
This standard specifies the general technical requirements, testing methods, and quality acceptance criteria for integral substrates used in System in Package (SiP) designs. It applies to the design, manufacturing, and procurement of multi-layer ceramic or organic substrates that integrate multiple semiconductor dies and passive components into a single package. The standard is primarily used in the electronics industry for high-density, miniaturized electronic modules such as those in smartphones, IoT devices, and advanced computing systems.
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