GB/T 43538-2023

Active

Quality and technical requirements for metal packages used for integrated circuits

集成电路金属封装外壳质量技术要求

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2023-12-28
Implementation
2024-07-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies the quality and technical requirements for metal packages used in integrated circuits, covering materials, structural dimensions, electrical performance, and reliability testing. It is applied in the manufacturing and procurement of hermetic metal enclosures for ICs, particularly in aerospace, military, and high-reliability electronics where protection against environmental factors is critical. The standard ensures consistency in package quality for semiconductor assembly and end-use validation.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.