GB/T 43536.1-2023
ActiveThree dimensional integrated circuit—Part 1：Terminologies and definitions
三维集成电路 第1部分：术语和定义
Application Summary AI generated
This standard provides a unified set of terminologies and definitions specifically for the field of three-dimensional integrated circuits (3D ICs). It is applied in the design, manufacturing, testing, and academic research of advanced semiconductor devices that utilize vertical stacking and through-silicon vias (TSVs) to achieve higher density and performance. The standard ensures clear communication and consistency among engineers, researchers, and procurement professionals working with 3D IC technology.
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