GB/T 42968.2-2024
ActiveIntegrated circuits—Measurement of electromagnetic immunity—Part 2: Measurement of radiated immunity—TEM cell and wideband TEM cell method
集成电路 电磁抗扰度测量 第2部分：辐射抗扰度测量 TEM小室和宽带TEM小室法
Application Summary AI generated
This standard specifies the use of TEM (Transverse Electromagnetic) cells and wideband TEM cells for measuring the radiated electromagnetic immunity of integrated circuits. It is applied in the electronics industry to evaluate how ICs withstand radiated electromagnetic interference during design validation, qualification testing, and compliance assessments. The method is particularly relevant for automotive, consumer electronics, and telecommunications components where consistent immunity performance is critical.
Related Standards
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 19248-2003
Test method for measuring the resistance of package leads
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.