GB/T 42895-2023
ActiveMicro-electromechanical systems（MEMS）technology—Bending strength test method for microstructures of silicon based MEMS
微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法
Application Summary AI generated
This standard specifies a test method for measuring the bending strength of silicon-based microstructures used in MEMS devices. It is applied in the design, manufacturing, and quality evaluation of MEMS components such as micro-cantilevers, bridges, and diaphragms, particularly for reliability testing in the semiconductor and microelectronics industries.
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