GB/T 41213-2021

Active

Integrated circuit full automatic die bonder

集成电路用全自动装片机

Standard Type
GBT
ICS
31.220
CCS
L95
Status
Active
Issue Date
2021-12-31
Implementation
2022-07-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

GB/T 41213-2021 specifies technical requirements, test methods, inspection rules, and marking/packaging for full automatic die bonders used in integrated circuit packaging. It applies to the design, manufacturing, and quality verification of equipment that precisely places semiconductor chips onto leadframes or substrates in high-volume production lines. The standard ensures consistent bonding accuracy, throughput, and reliability for IC assembly in electronics manufacturing facilities.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.