GB/T 39975-2021
ActiveAluminum nitride ceramic dissipate heat substrates
氮化铝陶瓷散热基片
Application Summary AI generated
GB/T 39975-2021 specifies the technical requirements, test methods, inspection rules, and packaging for aluminum nitride ceramic substrates used as heat dissipation components in electronic devices. It applies to the manufacturing and quality control of these substrates in high-power LED lighting, power modules, and integrated circuit packaging where efficient thermal management is critical. The standard ensures consistent thermal conductivity, mechanical strength, and dimensional accuracy for reliable performance in heat-sensitive electronic applications.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.