GB/T 39842-2021
ActiveItegrated circuit (IC)card packaging framework
集成电路（IC）卡封装框架
Application Summary AI generated
This standard specifies the technical requirements, dimensions, materials, and testing methods for the packaging framework used in integrated circuit (IC) cards, including contact and contactless types. It is applied in the manufacturing and quality inspection of IC card packaging, such as bank cards, SIM cards, and identification cards, ensuring structural integrity and compatibility with card body lamination processes.
Related Standards
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/T 17574.10-2003
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GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 19248-2003
Test method for measuring the resistance of package leads
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
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