GB/T 39163-2020
ActiveTest methods of the bonding strength for target-backing plate assemblies
靶材与背板结合强度测试方法
Application Summary AI generated
This standard specifies test methods for evaluating the bonding strength between a sputtering target and its backing plate assembly. It is applied in the manufacturing and quality control of physical vapor deposition (PVD) targets used in semiconductor, flat panel display, and optical coating industries. The methods ensure reliable adhesion under thermal and mechanical stresses during sputtering processes.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.