GB/T 36479-2018

Active

Integrated circuits—Test methods for column grid array

集成电路 焊柱阵列试验方法

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2018-06-07
Implementation
2019-01-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies test methods for evaluating the mechanical and electrical integrity of column grid array (CGA) interconnections in integrated circuits. It is applied in the semiconductor industry for quality assurance and reliability testing of high-density packaging used in aerospace, telecommunications, and high-performance computing systems. The standard ensures consistent assessment of solder column fatigue, shear strength, and thermal cycling performance under specified conditions.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.