GB/T 36479-2018
ActiveIntegrated circuits—Test methods for column grid array
集成电路 焊柱阵列试验方法
Application Summary AI generated
This standard specifies test methods for evaluating the mechanical and electrical integrity of column grid array (CGA) interconnections in integrated circuits. It is applied in the semiconductor industry for quality assurance and reliability testing of high-density packaging used in aerospace, telecommunications, and high-performance computing systems. The standard ensures consistent assessment of solder column fatigue, shear strength, and thermal cycling performance under specified conditions.
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