GB/T 35010.8-2018
ActiveSemiconductor die products—Part8: EXPRESS model schema for data exchange
半导体芯片产品 第8部分：数据交换的EXPRESS格式
Application Summary AI generated
This standard specifies an EXPRESS model schema for the data exchange of semiconductor die products, enabling consistent representation and transfer of design and manufacturing information. It is applied in the semiconductor industry for integrated circuit (IC) design, fabrication, and supply chain management, particularly when exchanging die-level data between different software tools or organizations. The standard ensures interoperability and accuracy in describing die geometry, electrical characteristics, and packaging details during product development and procurement.
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