GB/T 35010.7-2018
ActiveSemiconductor die products—Part 7: XML schema for data exchange
半导体芯片产品 第7部分：数据交换的XML格式
Application Summary AI generated
This standard defines an XML schema for exchanging data related to semiconductor die products, such as bare chips and wafers. It is applied in the semiconductor industry to facilitate standardized, machine-readable communication of product specifications, test results, and supply chain information between manufacturers, designers, and distributors. The schema ensures consistent data formatting for automated data exchange in design, procurement, and quality assurance processes.
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