GB/T 35010.6-2018
ActiveSemiconductor die products—Part 6: Requirements for concerning thermal simulation
半导体芯片产品 第6部分：热仿真要求
Application Summary AI generated
This standard specifies the requirements for thermal simulation of semiconductor die products, including modeling methods, boundary conditions, and validation procedures. It is applied in the design and development of integrated circuits and discrete semiconductor devices to predict thermal performance and ensure reliability under operating conditions. The standard is used by engineers in the electronics industry for thermal management analysis during product design and qualification testing.
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