GB/T 35010.4-2018
ActiveSemiconductor die products—Part 4: Requirements for die users and suppliers
半导体芯片产品 第4部分：芯片使用者和供应商要求
Application Summary AI generated
This standard specifies the contractual and technical requirements for the exchange of semiconductor die products between suppliers and users, covering quality assurance, handling, storage, and documentation. It is applied in the electronics industry for the procurement, supply, and testing of unpackaged semiconductor die used in hybrid circuits, multi-chip modules, and advanced packaging applications.
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