GB/T 35010.3-2018
ActiveSemiconductor die products—Part 3: Guide for handling, packing and storage
半导体芯片产品 第3部分：操作、包装和贮存指南
Application Summary AI generated
This standard provides guidelines for the handling, packing, and storage of semiconductor die products to prevent physical damage, contamination, and electrostatic discharge. It is applied in the electronics industry by manufacturers, distributors, and users of bare semiconductor chips, particularly during assembly, testing, and logistics operations. The guide ensures product integrity and reliability throughout the supply chain for integrated circuits and discrete devices.
Related Standards
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 19248-2003
Test method for measuring the resistance of package leads
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.