GB/T 35010.2-2018
ActiveSemiconductor die products—Part 2: Exchange data formats
半导体芯片产品 第2部分：数据交换格式
Application Summary AI generated
This standard specifies the data exchange formats for semiconductor die products, including file structures, data fields, and encoding rules. It is applied in the semiconductor industry for the transfer of design, manufacturing, and testing data between chip suppliers, assembly houses, and end users. The standard ensures interoperability and consistency in data exchange for bare die and wafer-level products.
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