GB/T 35010.1-2018
ActiveSemiconductor die products—Part 1：Requirements for procurement and use
半导体芯片产品 第1部分：采购和使用要求
Application Summary AI generated
This standard specifies the procurement, handling, storage, and usage requirements for semiconductor die products (bare chips). It is applied in the electronics industry by manufacturers and assemblers who integrate unpackaged semiconductor dies into hybrid circuits, multi-chip modules, or system-in-package (SiP) devices. The standard ensures quality control and reliability during the sourcing and assembly processes, particularly for high-reliability applications.
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