GB/T 35005-2018

Active

Test methods for flip chip integrated circuits

集成电路倒装焊试验方法

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2018-03-15
Implementation
2018-08-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies test methods for evaluating the mechanical, electrical, and thermal reliability of flip chip integrated circuits, including solder joint integrity and underfill performance. It is applied in the semiconductor manufacturing and assembly industry for quality assurance and failure analysis of flip chip packages used in high-performance computing, mobile devices, and automotive electronics. The standard guides engineers in conducting standardized tests to ensure product robustness under thermal cycling, shear stress, and moisture exposure.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.