GB/T 34894-2017
ActiveMicro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer
微机电系统（MEMS）技术 基于光学干涉的MEMS微结构应变梯度测量方法
Application Summary AI generated
This standard specifies a method for measuring the strain gradient in MEMS microstructures using an optical interferometer. It is applied in the design, manufacturing, and quality control of micro-electromechanical systems to evaluate residual stress and deformation in thin-film layers and released structures. The method is critical for ensuring the reliability and performance of MEMS devices such as accelerometers, gyroscopes, and micro-mirrors in consumer electronics, automotive, and aerospace industries.
Related Standards
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 19248-2003
Test method for measuring the resistance of package leads
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.