GB/T 33922-2017

Active

Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances

MEMS压阻式压力敏感芯片性能的圆片级试验方法

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2017-07-12
Implementation
2018-02-01
Centralized Committee
国家标准委
Issuing Authority
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the wafer-level test methods for evaluating the performance of MEMS piezoresistive pressure-sensitive dies, including parameters such as sensitivity, offset voltage, and linearity. It is applied during the manufacturing process of MEMS pressure sensors, specifically at the wafer fabrication stage before dicing and packaging, to ensure die quality and consistency. The standard is used by semiconductor manufacturers and testing facilities in the microelectronics industry for production monitoring and quality control.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.