GB/T 33377-2016
ActiveNon-silicon release liner for flexible PC base film
软性电路板覆盖膜用非硅离型材料
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging for non-silicon release liners used with flexible printed circuit (FPC) coverlay films. It is applied in the electronics manufacturing industry to ensure that the release liner protects the adhesive layer of the coverlay during lamination and can be cleanly peeled away without leaving silicone residue. The standard is critical for quality control in the production of flexible circuits, particularly for applications where silicone contamination could impair subsequent soldering or bonding processes.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.