GB/T 32280-2015
AbolishedTest method for warp of silicon wafers—Automated non-contact scanning method
硅片翘曲度测试 自动非接触扫描法
Application Summary AI generated
This standard specifies an automated non-contact scanning method for measuring the warp of silicon wafers, which is the deviation of the wafer's median surface from a reference plane. It is applied in the semiconductor manufacturing industry for quality control and process monitoring of polished or epitaxial silicon wafers used in integrated circuit fabrication. The method ensures accurate, repeatable warp measurements without physically contacting the wafer surface, preventing damage during testing.
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