GB/T 3131-2001

Abolished

Tin-lead solder

锡铅钎料

Standard Type
GBT
ICS
25.160.50
CCS
H62
Status
Abolished
Issue Date
2001-05-29
Implementation
2001-11-01
Centralized Committee
中国有色金属工业协会
Issuing Authority
中国有色金属工业协会

Application Summary AI generated

GB/T 3131-2001 specifies the classification, technical requirements, test methods, and inspection rules for tin-lead solder alloys used in brazing and soldering applications. It is primarily applied in the electronics and electrical industries for joining components on printed circuit boards, as well as in general manufacturing for metal joining where controlled melting points and mechanical strength are required. This standard ensures consistency in solder composition and performance for both manual and automated soldering processes.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.