GB/T 30869-2014
ActiveTest method for thickness and total thickness variation of silicon wafers for solar cell
太阳能电池用硅片厚度及总厚度变化测试方法
Application Summary AI generated
This standard specifies the test methods for measuring the thickness and total thickness variation (TTV) of silicon wafers used in solar cell manufacturing. It is applied in the photovoltaic industry for quality control during wafer production and incoming inspection, ensuring wafers meet dimensional tolerances critical for efficient cell processing and device performance. The standard covers contact and non-contact measurement techniques, providing a uniform testing protocol for manufacturers and testing laboratories.
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