GB/T 30860-2014
ActiveTest methods for surface roughness and saw mark of silicon wafers for solar cells
太阳能电池用硅片表面粗糙度及切割线痕测试方法
Application Summary AI generated
This standard specifies the test methods for measuring surface roughness and saw marks on silicon wafers used in solar cell manufacturing. It is applied in the photovoltaic industry to evaluate wafer quality after slicing, ensuring consistent surface characteristics for subsequent cell processing. The methods are used by wafer producers and quality control labs to verify compliance with production specifications.
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