GB/T 28277-2012
ActiveSilicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
硅基MEMS制造技术 微键合区剪切和拉压强度检测方法
Application Summary AI generated
This standard specifies the measurement methods for evaluating the shear and pull-press strength of micro bonding areas in silicon-based MEMS (Micro-Electro-Mechanical Systems) fabrication. It is applied in the semiconductor and microelectronics industries to ensure the mechanical reliability and quality of bonded interfaces in MEMS devices, such as sensors, actuators, and microstructures. The standard is used during manufacturing process control and product testing to verify bond integrity under mechanical stress conditions.
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