GB/T 28276-2012
ActiveSilicon-based MEMS fabrication technology - Specification for the dissolved wafer process
硅基MEMS制造技术 体硅溶片工艺规范
Application Summary AI generated
This standard specifies the technical requirements, process parameters, and quality control methods for the dissolved wafer process used in silicon-based MEMS (Micro-Electro-Mechanical Systems) fabrication. It is applied in the manufacturing of MEMS devices such as accelerometers, gyroscopes, and pressure sensors, particularly in the electronics and semiconductor industries. The standard ensures consistency and reliability during the batch production of microstructures that require precise silicon etching and wafer bonding.
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